※ Available to bare and mounted wafer marking.

※ ±50um as marking position accuracy.

※ High productivity with multi-laser beam solution.

※ Optimized warpage wafer handling system.

※ Build-in APC system for power monitoring.

※ Build-in high accuracy vision system for alignment and scanner calibration.

※ Super high accuracy AOI system.

※ MPW wafer is available and easy to build recipe.

Product Advantages:

※ Strip type marking position metrology(2D)

※ Unit (In tray) marking position metrology (2D)

※ Marking depth metrology(3D)

※ Position compensation to marking machine.

※ Replace marking jig.

※ Replacing dummy singulation for marking position confirmation on small PKG.

※ Metrology accuracy(2D): ±10um..

※ Depth metrology accuracy(3D): ±0.1um.

※ Auto Load/Unload.

※ Selectable unit metrology for 2D/3D automatically.

※ Super high speed: 7S/strip(2D); 2S/Unit(3D)

Application:

Advantage: